ICICE 2018 Proceeding
978-0-367-02959-3
ICASI 2015 Proceedings
ISBN: 9781138028937indexed by EI
CRC Press online
ICASI 2016 Proceedings
ISBN: 978146739886
indexed by EI
IEEE Xplore online
ICASI 2017 Proceedings
ISBN: 9781509048977
indexed by EI
IEEE Xplore online
ICICE 2014 Proceeding
978-1-138-02752-7
CRC Press online
ICICE 2013 Proceeding
978-1-138-00117-6
CRC Press online
IEEE ICICE 2019 Call for Papers
8th IEEE International Conference on Innovation, Communication and Engineering 2019
(IEEE ICICE 2019)
October 25-30, 2019, Zhengzhou (鄭州) , Henan Province, China
Email: office.icice@gmail.com
Organized by:
IEEE Tainan Section Sensors Council (IEEE TSSC)
Taiwanese Institute of Knowledge Innovation, TIKI
National Cheng Kung University
Fujian University of Technology
National Kaohsiung University of Science and Technology
National Yunlin University of Science and Technology
Southern Taiwan University of Science and Technology
The 8th IEEE International Conference on Innovation, Communication and Engineering 2019 (IEEE ICICE 2019) is organized by IEEE Tainan Section Sensors Council (IEEE TSSC) and Taiwanese Institute of Knowledge Innovation (TIKI), and will be held in Zhengzhou, Henan Province, China on October 25~30, 2019. It will provide a unified communication platform for researchers with a wide range of topics, such as information technology, innovation design, communication science & engineering, industrial design, creative design, applied mathematics, computer science, design theory, cultural & creative research, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering, material science and other related fields. Professionals from industry, academia and government are encouraged to discourse on research and development. Professional practice, business and management in the information, innovation, communication and engineering fields are welcome to participate in IEEE ICICE 2019. This conference enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally. During the conference, there will be substantial time for presentation and discussion. Attendants will find various activities useful in bringing together a diverse group of engineers and technologists across the disciplines for the generation of new ideas, collaboration potential and business opportunities. Submitted manuscripts will be reviewed by three reviewers in 1 week.
Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases.
(1) Materials (SCI; ISSN 1996-1944; IF: 2.972; 10% discount of publication fee)
(2) Energies (SCI; ISSN 1996-1073; IF: 2.707; 10% discount of publication fee)
(3) Sensors (SCI; ISSN 1424-8220; IF: 3.031; 10% discount of publication fee)
(4) Applied Sciences (SCI; ISSN 2076-3417; IF: 2.217; 10% discount of publication fee)
(5) Micromachines (SCI; ISSN: 2072-666X; IF: 2.426)
(6) Coatings (SCI; ISSN: 2079-6412; IF: 2.330)
(7) Microsystem Technologies (SCI; ISSN: 1432-1858; IF: 1.513)
(8) Sustainability (SCI and SSCI; ISSN 2071-1050; IF: 2.592)
(9) Sensors and Materials (SCI; ISSN: 0914-4935; IF: 0.468)
(10) Journal of Internet Technology (JIT) (SCI; ISSN 1207-9264; IF: 0.715)
(11) Applied System Innovation (ISSN 2571-5577)
(12) Journal of Cultural and Creative Industries Research (ISSN: 2308-5193; Chinese version)
(13) Journal of Science and Innovation (ISSN: 2078-5453; English version, free charge